Haris Zografos

BESI specializes in die bonding, packaging, and plating equipment used in the back-end semiconductor manufacturing process. The company's technology is used to attach individual semiconductor dies to substrates or other dies with extreme precision. BESI's most exciting growth driver is its hybrid bonding technology — a direct die-to-die and die-to-wafer bonding technique that enables the ultra-dense chip interconnections required for advanced AI processors. As chipmakers move toward chiplet architectures and 3D stacking for AI chips, hybrid bonding becomes an essential manufacturing step. BESI is a technology leader in this space, positioning it as a direct beneficiary of the AI chip manufacturing buildout. Zografos' key decisions involve hybrid bonding technology commercialization, capacity expansion, R&D investment in next-generation bonding technologies, and managing the cyclical nature of semiconductor equipment demand.